Mixing ratio for this product is 2 parts A to 1 part of B. Please be advised that there is a misprint on our label for one of the production runs.
sensitive electronic components from impact, shock, vibration, heat, conductivity,
moisture, chemicals, and visual inspection.
MG 2-part epoxy compound for potting and encapsulating electronics. Includes black resin and hardner, mixed 2:1.
water and chemical resistant
impact resistant (contains a form of nylon)
black, to prevent visual inspection
high security, once cured, extremely difficult to remove
an electrical insulator
for explosion proof components (spark arresting)
and simple to mix
be cured in one hour at 65°C (150°F)
- This product is RoHS compliant
Mix is ready in about 30 minutes.
375ml - 12oz Compound.
NOTE: THIS PRODUCT CANNOT BE SHIPPED BY AIR - IT MUST SHIP UPS GROUND ONLY